Kemet Chemo-textile Pads :
- These are manufactured to the highest standards with accurately controlled uniform thickness.
- Self-adhesive, and available in medium (PSU-M) and hard (PAD-K) formats.
- Chem Cloth is also available for Chemo-mechanical Polishing.
PSU-M – A firm, dense and uniform non-woven polishing pad with absorbent fibres, mechanically and chemically bonded. It has a buffed surface and produces excellent flatness. It is intended for general polishing with diamond compounds, 25 micron or finer.
PAD-K – The ultra-hard chemo-textile pad used where fast cutting is needed.
Kemet Silk-Type Pads
- Kemet silk-type pads have been developed for finishing metal specimens and components.
- The five types available are MSFL, MSF, MSR , MST and ULP.
ASFL – Self adhesive woven artificial polishing pad constructed with an internal barrier film. The adhesive backing is protected from hydrocarbon or oil-based slurries and lubricants. Suitable for the preparation of metallurgical specimens with fine diamond compounds 6µm or finer. Achieves excellent flatness and surface finish.
MSFL – Will polish metal flat, and to a mirror finish. Best results are obtained when used with Kemet Diamond Compound or Diamond Suspension 3 micron and finer. Water resistant adhesive (oil resistant available).
MSR – Similar to MSFL with rigid plastic backing. It has good chemical resistance and produces excellent flatness and a mirror finish on most metals. The cloth face is synthetic silk mounted onto a fluid resistant barrier.
MST – An extra hard, rigid silk cloth for increased cutting action.
ULP – A heavy duty nylon pad for high stock removal.
ASR – Suitable for the preparation of metallurgical specimens with fine diamond compounds 6μm or finer. Mounted on a rigid barrier foil. The adhesive backing is protected from hydrocarbon or oil-based slurries and lubricants. Achieves excellent flatness and surface finish.
AST – Used for increased cutting action and good general flatness control. Use with 15 – 6 micron diamond before final polishing.
Kemet Nap-Type Pads
- For final polishing stages of preparation,
- Kemet Nap Type Pads are available with a range of softness and nap length.
- They give a more gentle polish, and are ideal for softer specimens and components.
- All pads are self-adhesive unless marked ‘plain’.
NFC– Synthetic flock sprayed on cotton carrier. Can be used with 1 micron Kemet Diamond Compound after a smoothing operation on ASF to produce a mirror finish on soft materials.
MBL– Synthetic flock sprayed on cotton carrier. Used with 3 micron Kemet Diamond Compound after 6 micron ASF-AW stage.
MRE– Synthetic flock sprayed on a flexible waterproof carrier. A more heavy duty pad for use with 6 micron Kemet Diamond Compound and finer.
NSH-B – Short nap pad with woven backing used for metallographic and some optical polishing operations. Commonly used with Kemet Diamond Compound 3 Micron and finer.
NLH – Very soft, flocked polishing pad made with absorbent viscose fibres bound with a polyurethane resin on a woven cotton substrate. It is intended for final polishing with abrasive slurries or diamond compound 3µm or finer.
NMH – Napped pad with uni-directional fibres bonded to a cotton twill backing. A durable, wear resistant pad. Commonly used with 6 micron Kemet Diamond compound or finer.
Chem-H – Buffed polyurethane with microscopic voids, laminated to a non-woven substrate. A more closed pore structure which gives a longer life time and higher stock removal. The very fine fibres are mainly horizontally oriented and they make the pad more dense. Ideal polishing pad for use with colloidal silica chemical mechanical polishing.
LIL-Plus- Long nap synthetic pad. Commonly used with 3 micron Kemet Diamond compound or finer.
Selvyt SR – A cotton pad of medium nap with a single pile. Available only as non-adhesive.
Kan – High quality woven textile made of 100% wool. This pad gives excellent flatness and high quality polished finishes when used with diamond compounds from 1-6 Micron. For intermediate and final polishing of ferrous and non-ferrous metals and polymers.